Max Headroom 
The third and final machine learning presentation before the afternoon break comes from Huawei. Unlike many of the other ML vendors who are here to pitch products, Huawei’s presentation is more focused on fundamental technology. In this case, how to use efficiently use meshes to interconnect the chips within large AI systems. Eyeing so-called SuperNodes […]
The post Huawei Presents UB-Mesh Interconnect for Large AI SuperNodes at Hot Chips 2025 appeared first on ServeTheHome.
Accelerators, AI, News, Hot Chips 2025, Huawei, networking
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